(WO/2005/018294) DEVICE FOR FIXING A MODULE TO A PRINTED CIRCUIT BOARD
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| Latest bibliographic data on file with the International Bureau
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| Pub. No.: | WO/2005/018294 | International Application No.: | PCT/EP2004/051459 | |||
| Publication Date: | 24.02.2005 | International Filing Date: | 12.07.2004 |
| IPC: | H05K 3/30 (2006.01), H05K 1/14 (2006.01) | |||||
| Applicants: | SIEMENS AKTIENGESELLSCHAFT [DE/DE]; Wittelsbacherplatz 2, 80333 München (DE) (All Except US). BAUR, Hans-Peter [DE/DE]; (DE) (US Only). HÄNIG, Ulrich [DE/DE]; (DE) (US Only). KRIPS, Tobias [DE/DE]; (DE) (US Only). STETTER-ALLE, Raimund [DE/DE]; (DE) (US Only). | |||||
| Inventors: | BAUR, Hans-Peter; (DE). KRIPS, Tobias; (DE). STETTER-ALLE, Raimund; (DE). | |||||
| Common Representative: | SIEMENS AKTIENGESELLSCHAFT; Postfach 22 16 34, 80506 München (DE) . | |||||
| Priority Data: |
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| Title: |
(EN) DEVICE FOR FIXING A MODULE TO A PRINTED CIRCUIT BOARD (DE) VORRICHTUNG ZUR HALTERUNG EINER MODULEINHEIT AUF EINER LEITERPLATTE | |||||
| Abstract: |
(EN) The invention relates to a device for fixing a module to a printed circuit board (2) of an electric device, the former device comprising: a retaining element (5) that is attached to the printed circuit board (2) and projects from the plane of the latter (2) and a snap-in assembly (16, 18) comprising a snap-in element (16, 18) that is provided on the retaining element (5) and a corresponding snap-in element (18, 16) that is provided on the module, for fixing said module to the retaining element (5). (DE) Vorrichtung zur Halterung einer Moduleinheit auf einer Leiterplatte (2) eines elektrischen Gerätes mit: einem aus der Ebene der Leiterplatte (2) herausragenden und an der Leiterplatte (2) angebrachten Halteelement (5) und einer Rastanordnung (16,18) mit einem am Halteelement (1) vorgesehenen Rastelement (16,18) und einem an der Moduleinheit vorgesehenen, korrespondierenden Rastelement (18,16) zur Befestigung der Moduleinheit am Halteelement (5). | |||||
| Designated States: |
AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW. African Regional Intellectual Property Org. (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW) Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM) European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR) African Intellectual Property Organization (OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). |
| Publication Language: | German (DE) |
| Filing Language: | German (DE) |
