(WO/2003/017301) SNAP ACTION THERMAL SWITCH
(WO/2003/017301) SNAP ACTION THERMAL SWITCH
Latest bibliographic data on file with the International Bureau
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| Pub. No.: | | WO/2003/017301 | |
International Application No.: | | PCT/US2002/026439 |
| Publication Date: | 27.02.2003 |
International Filing Date: | 20.08.2002 |
| Chapter 2 Demand Filed: 20.03.2003 |
| IPC: |
H01H 1/00 (2006.01), H01H 37/46 (2006.01), H01H 1/20 (2006.01) |
| Applicant: | HONEYWELL INTERNATIONAL INC. [US/US]; Law Department, 101 Columbia Road, P.O. Box 2245, Morristown, NJ 07962-2245 (US). |
| Inventors: | DAVIS, George; (US).
BECKA, Stephen; (US). |
| Agent: | CRISS, Roger et al.; Honeywell International Inc., 101 Columbia Road, P.O. Box 2245, Morristown, NJ 07962-2245 (US)
. |
| Priority Data: | |
| Title: |
SNAP ACTION THERMAL SWITCH
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| Abstract: |
A simplified snap-action micromachined thermal switch having a bimodal thermal actuator fabricated from non-ductile materials such as silicon, glass, silicon oxide, tungsten, and other suitable materials using MEMS techniques. |
| Designated States: |
CN, JP, KR.
European Patent Office (EPO) (CH, DE, FR, GB, SE).
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| Publication Language: | English (EN) |
| Filing Language: | English (EN) |
