(WO/2001/078199) PRINTED CIRCUIT BOARD ASSEMBLY

(WO/2001/078199) PRINTED CIRCUIT BOARD ASSEMBLY

Latest bibliographic data on file with the International Bureau
Pub. No.:  WO/2001/078199   International Application No.:  PCT/US2001/011840
Publication Date:18.10.2001 International Filing Date:11.04.2001
Chapter 2 Demand Filed: 09.11.2001
IPC: H05K 3/36 (2006.01), H05K 1/14 (2006.01), H05K 3/34 (2006.01)
Applicants:POWER-ONE, INC. [US/US]; 740 Calle Plano Camarillo, CA 93012 (US) (All Except US).
LIU, Hanson [US/US]; (US) (US Only).
LU, Qun [CN/US]; (US) (US Only).
Inventors:LIU, Hanson; (US).
LU, Qun; (US).
Agent:LICHAUCO, Faustino, A.; Fish & Richardson, P.C. 225 Franklin Street Boston, MA 02110-2804 (US) .
Priority Data:
09/546,731 11.04.2000 US
09/739,167 18.12.2000 US
Title: PRINTED CIRCUIT BOARD ASSEMBLY
Abstract: In printed circuit board fabrication, processing steps for components on one section of the board are sometimes incompatible with processing steps for components on another section of the board. The method of the invention provides for physically separate printed circuit board sections that are processed separately and joined together following processing. To provide electrical connection between a first component on a first printed circuit board section and a second component on a second printed circuit board section, the method of the invention includes the steps of connecting the first and second components to conducting regions disposed on edges of their respective printed circuit board sections. The two printed circuit board sections are then joined together so that the two conducting regions contact each other.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CR, CU, CZ, DE, DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Org. (ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language:English (EN)
Filing Language:English (EN)

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