(WO/1996/029849) METHOD AND DEVICE FOR MANUFACTURING PRINTED WIRING BOARD
- Biblio. Data
- Description
- Claims
- National Phase
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| Latest bibliographic data on file with the International Bureau
|
| Pub. No.: | WO/1996/029849 | International Application No.: | PCT/JP1995/000503 | |||
| Publication Date: | 26.09.1996 | International Filing Date: | 20.03.1995 |
| IPC: | H05K 3/06 (2006.01), H05K 3/10 (2006.01) |
| Applicants: | HITACHI, LTD. [JP/JP]; 6, Kanda Surugadai 4-chome, Chiyoda-ku, Tokyo 101 (JP) (All Except US). KOBAYASHI, Shirou [JP/JP]; (JP) (US Only). MIYAZAKI, Masashi [JP/JP]; (JP) (US Only). TAKADA, Toshinari [JP/JP]; (JP) (US Only). |
| Inventors: | KOBAYASHI, Shirou; (JP). MIYAZAKI, Masashi; (JP). TAKADA, Toshinari; (JP). |
| Agent: | OGAWA, Katsuo; Kabushiki Kaisya Hitachi Seisakusyo, 5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo 100 (JP) . |
| Title: | METHOD AND DEVICE FOR MANUFACTURING PRINTED WIRING BOARD |
| Abstract: | A wiring pattern forming method in which when the underlying copper foil of the copper wiring pattern is etched, the side-etching of the pattern is small and consequently the wiring resistance increases little. Before removing a resist pattern (3) by use of aqueous remover from a wiring board on which a solder electroplating film (7) is formed on the surface of copper-plating pattern (5) formed on an insulating board (1), dissolved oxygen in the aqueous remover is removed by blowing an intert gas into the remover or adding a reducing deoxydizer to the remover to prevent the solder plating film (7) from dissolving and peeling. Thereafter, the foil (2) and the film (7) are removed to produce an independent copper wiring pattern on the board (1). Since the side etching of the copper wiring pattern can be reduced during the etching of the foil (2), increase of the wiring resistance of the pattern caused by the etching can be prevented. |
| Designated States: |
CA, CN, JP, KR, US. European Patent Office (EPO) (AT, BE, CH, DE, DK, ES, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE). |
| Publication Language: | Japanese (JA) |
| Filing Language: | Japanese (JA) |
