(WO/2008/076414) SELF-REPLICATING MATERIALS

(WO/2008/076414) SELF-REPLICATING MATERIALS

Latest bibliographic data on file with the International Bureau
Pub. No.:  WO/2008/076414   International Application No.:  PCT/US2007/025749
Publication Date:26.06.2008 International Filing Date:17.12.2007
IPC: C12Q 1/68 (2006.01)
Applicants:NEW YORK UNIVERSITY [US/US]; 650 First Avenue, New York, NY 10016 (US) (All Except US).
CHAIKIN, Paul Michael [US/US]; (US) (US Only).
PINE, David [US/US]; (US) (US Only).
SEEMAN, Nadrian [US/US]; (US) (All Except US).
GRIER, David G. [US/US]; (US) (US Only).
Inventors:CHAIKIN, Paul Michael; (US).
PINE, David; (US).
GRIER, David G.; (US).
Agent:RECHTIN, Michael D. et al.; Foley & Lardner Llp, 321 N. Clark Street, Ste. 2800, Chicago, IL 60610 (US).
Priority Data:
60/875,272 15.12.2006 US
Title: SELF-REPLICATING MATERIALS
Abstract: The invention provides micron and sub-micron scale particles designed to recognize and selectively interact with each other by exploiting the recognition and specificity enabled by DNA-sequence-encoded coatings. Such materials possess sufficient information coded in their chemical and physical interactions to self assemble and self replicate. The invention further provides methods of using such materials to create self replicating and organizing materials. Replicated copies are permanently linked and then thermally detached, freeing them to act as templates for further growth. This new class of condensed matter systems, provides means to design and control the structure and function of materials and machines from the microscopic to life-size. In another aspect of the invention, depletion type forces and depletion zones can be utilized in the implementation of the self assembly and self replication of materials, including without limitation colloidal particles. The invention further provides novel means of synthesis and materials built by such synthesis, which may be used in a variety of applications, including microelectronics.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Org. (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language:English (EN)
Filing Language:English (EN)

PATENTSCOPE®

Related Links

E-Newsletters