(WO/2007/091424) BRAIN-COOLING APPARATUS TO BE BURIED IN SKULL
- Biblio. Data
- Description
- Claims
- National Phase
- Notices
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| Latest bibliographic data on file with the International Bureau
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| IPC: | A61B 17/00 (2006.01), A61F 7/00 (2006.01) | ||||||||||||||||||
| Applicants: | Yamaguchi University [JP/JP]; 1677-1, Yoshida, Yamaguchi-shi, Yamaguchi
7538511 (JP) (All Except US). SAITO, Takashi [JP/JP]; (JP) (US Only). UCHIYAMA, Joji [JP/JP]; (JP) (US Only). SUZUKI, Michiyasu [JP/JP]; (JP) (US Only). FUJII, Masami [JP/JP]; (JP) (US Only). | ||||||||||||||||||
| Inventors: | SAITO, Takashi; (JP). UCHIYAMA, Joji; (JP). SUZUKI, Michiyasu; (JP). FUJII, Masami; (JP). | ||||||||||||||||||
| Agent: | Patent Corporate Body Dai-ichi Kokusai Tokkyo Jimusho; da Vinci Tamachi, 10-5, Shiba 4-chome Minato-ku, Tokyo 1080014 (JP). | ||||||||||||||||||
| Priority Data: |
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| Title: |
(EN) BRAIN-COOLING APPARATUS TO BE BURIED IN SKULL (JA) 頭蓋内埋め込み型大脳冷却装置 | ||||||||||||||||||
| Abstract: |
(EN) An apparatus for cooling down partially abnormal electroencephalogram (pyrexia) caused by extraordinary excitement in cerebral nerve cells in, for example, epilepsy that is a compact apparatus to be buried in the skull for topically cooling the brain. Namely, a brain-cooling apparatus to be buried in the skull which comprises a cooler made of a metal plate or wire to be buried in the skull, a heat pipe and a radiator, wherein one end of the heat pipe is connected to the cooler while the other end thereof is connected to the radiator each in such a manner as allowing heat transfer. (JA) 本発明は、てんかん等の大脳神経細胞の異常興奮による部分的な脳波異常（発熱）を沈静化するための装置であって、コンパクトな装置を頭蓋内に埋め込み、脳を局部的に冷却するものである。 頭蓋内に挿入するための金属板又は線状の冷却部、ヒートパイプ及び放熱部よりなり、該ヒートパイプの一端は冷却部に、また他端は放熱部にそれぞれ伝熱可能に接続された頭蓋内埋め込み型大脳冷却装置である。 | ||||||||||||||||||
| Designated States: |
AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. African Regional Intellectual Property Org. (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW) Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM) European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR) African Intellectual Property Organization (OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). | ||||||||||||||||||
| Publication Language: | Japanese (JA) |
| Filing Language: | Japanese (JA) |
