|
|
|
|
Search result: 59 of 110 |
(WO/2008/021191) PIEZOELECTRIC COMPOSITIONS
- Biblio. Data
- Description
- Claims
- National Phase
- Notices
- Documents
| Latest bibliographic data on file with the International Bureau
| ||||||||||||
| ||||||||||||
| IPC: | H03H 9/58 (2006.01) | |||||||||||
| Applicants: | THE JOHNS HOPKINS UNIVERSITY [US/US]; Johns Hopkins Technology Transfer, 3400 N. Charles Street, Baltimore, MD 21218 (US) (All Except US). YU, Michael [US/US]; (US) (US Only). WEST, James, E. [US/US]; (US) (US Only). BUSH-VISHNIAC, Ilene, J. [US/US]; (US) (US Only). FARRAR, Dawnielle [US/US]; (US) (US Only). | |||||||||||
| Inventors: | YU, Michael; (US). WEST, James, E.; (US). BUSH-VISHNIAC, Ilene, J.; (US). FARRAR, Dawnielle; (US). | |||||||||||
| Agent: | CORLESS, Peter, F.; Edwards Angell Palmer & Dodge Llp, P.o. Box 55874, Boston, MA 02205 (US). | |||||||||||
| Priority Data: |
| |||||||||||
| Title: | PIEZOELECTRIC COMPOSITIONS | |||||||||||
| Abstract: | Piezoelectric compositions are provided wherein mechanical and piezoelectric properties can be separately modulated. Preferred compositions include resin blends that comprise: (a) a piezoelectrically active polymer and (b) a matrix polymer, methods of making, and use of such resin blends. Advantages of preferred resin blends of the invention can include high piezoelectricity, mechanical strength and flexibility, convenient fabrication process, and high sensitivity at high temperatures. | |||||||||||
| Designated States: |
AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. African Regional Intellectual Property Org. (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW) Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM) European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR) African Intellectual Property Organization (OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). | |||||||||||
| Publication Language: | English (EN) |
| Filing Language: | English (EN) |

