H
SECTION H — ELECTRICITY
 H05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
 H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (casings for, or constructional details of, particular types of apparatus, see the relevant sub-classes; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes; details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R)
 H05K

Note(s)

  1. "Printed circuits" are understood as covering all kinds of mechanical constructions of circuits that consist of an insulating base or support carrying the conductor and are combined structurally with the conductor throughout their length, especially in a two-dimensional plane, the conductors of which are secured to the base in a non-dismountable manner, and also as covering the processes or apparatus for manufacturing such constructions, e.g. forming the circuit by mechanical or chemical treatment of a conductive foil, paste, or film on an insulating support.
  2. This sub-class is understood as covering combinations of a radio or television receiver with apparatus having a different main function.
  3. This sub-class is also understood as covering printed circuits structurally associated with non-printed electric components.
 H05K 1/00
Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
 H05K 1/02
·  Details
 H05K 1/03
·  ·  Use of materials for the substrate  [3]
 H05K 1/04
( transferred to H05K 1/11, H01R 9/09, H01R 23/68 )
 H05K 1/05
·  ·  ·  Insulated metal substrate  [3]
 H05K 1/06
( transferred to H01R 9/09, H01R 23/70 )
 H05K 1/07
( transferred to H01R 23/70 )
 H05K 1/08
( transferred to H01R 9/09, H01R 23/72 )
 H05K 1/09
·  ·  Use of materials for the metallic pattern  [3]
 H05K 1/10
( transferred to H01R 9/09 )
 H05K 1/11
·  ·  Printed elements for providing electric connections to or between printed circuits  [3]
 H05K 1/12
( transferred to H01R 23/72 )
 H05K 1/14
·  ·  Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K 1/11, H01R 9/09, H01R 23/68)
 H05K 1/16
·  incorporating printed electric components, e.g. printed resistor, capacitor, inductor
 H05K 1/18
·  Printed circuits structurally associated with non-printed electric components (H05K 1/16 takes precedence)
 H05K 3/00
Apparatus or processes for manufacturing printed circuits (preparation of originals for the photo-mechanical production of textured or patterned surfaces G03F 1/00; involving the manufacture of semiconductor devices H01L)
 H05K 3/02
·  in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
 H05K 3/04
·  ·  the conductive material being removed mechanically, e.g. by punching
 H05K 3/06
·  ·  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
 H05K 3/07
·  ·  ·  being removed electrolytically  [3]
 H05K 3/08
·  ·  the conductive material being removed by electric discharge, e.g. by spark erosion
 H05K 3/10
·  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
 H05K 3/12
·  ·  using printing techniques to apply the conductive material
 H05K 3/14
·  ·  using spraying techniques to apply the conductive material
 H05K 3/16
·  ·  ·  by cathodic sputtering
 H05K 3/18
·  ·  using precipitation techniques to apply the conductive material
 H05K 3/20
·  ·  by affixing prefabricated conductor pattern
 H05K 3/22
·  Secondary treatment of printed circuits
 H05K 3/24
·  ·  Reinforcing of the conductive pattern
 H05K 3/26
·  ·  Cleaning or polishing of the conductive pattern
 H05K 3/28
·  ·  Applying non-metallic protective coatings
 H05K 3/30
·  Assembling printed circuits with electric components, e.g. with resistor
 H05K 3/32
·  ·  electrically connecting electric components or wires to printed circuits
 H05K 3/34
·  ·  ·  by soldering
 H05K 3/36
·  Assembling printed circuits with other printed circuits
 H05K 3/38
·  Improvement of the adhesion between the insulating substrate and the metal  [3]
 H05K 3/40
·  Forming printed elements for providing electric connections to or between printed circuits  [3]
 H05K 3/42
·  ·  Plated through-holes  [3]
 H05K 3/44
·  Manufacturing insulated metal core circuits  [3]
 H05K 3/46
·  Manufacturing multi-layer circuits  [3]
 H05K 5/00
Casings, cabinets or drawers for electric apparatus (in general A47B; radio receiver cabinets H04B 1/08; television receiver cabinets H04N 5/64)
 H05K 5/02
·  Details
 H05K 5/03
·  ·  Covers
 H05K 5/04
·  Metal casings
 H05K 5/06
·  Hermetically-sealed casings
 H05K 7/00
Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K 5/00)
 H05K 7/02
·  Arrangements of circuit components or wiring on supporting structure
 H05K 7/04
·  ·  on conductive chassis
 H05K 7/06
·  ·  on insulating boards
 H05K 7/08
·  ·  ·  on perforated boards
 H05K 7/10
·  ·  Plug-in assemblages of components
 H05K 7/12
·  ·  Resilient or clamping means for holding component to structure (holding two-part couplings together H01R 13/00)
 H05K 7/14
·  Mounting supporting structure in casing or on frame or rack
 H05K 7/16
·  ·  on hinges or pivots
 H05K 7/18
·  Construction of rack or frame
 H05K 7/20
·  Modifications to facilitate cooling, ventilating, or heating
 H05K 9/00
Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an aerial H01Q 17/00)
 H05K 10/00
Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar stand-by unit
 H05K 11/00
Combinations of a radio or television receiver with apparatus having a different main function
 H05K 11/02
·  with vehicles
 H05K 13/00
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
 H05K 13/02
·  Feeding of components (in general B65G)
 H05K 13/04
·  Mounting of components
 H05K 13/06
·  Wiring by machine
 H05K 13/08
·  Monitoring manufacture of assemblages