PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (casings for, or constructional details of, particular types of apparatus, see the relevant sub-classes; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes; details of instruments or comparable details of other apparatus not otherwise provided for Fulltext... Hierarchy... Expanded...G12B; thin-film or thick-film circuits Fulltext... Hierarchy... Expanded...H01L 27/01, Fulltext... Hierarchy... Expanded...H01L 27/13; non-printed means for electric connections to or between printed circuits Fulltext... Hierarchy... Expanded...H01R)
H05K
Note(s)
"Printed circuits" are understood as covering all kinds of mechanical constructions of circuits that consist of an insulating base or support carrying the conductor and are combined structurally with the conductor throughout their length, especially in a two-dimensional plane, the conductors of which are secured to the base in a non-dismountable manner, and also as covering the processes or apparatus for manufacturing such constructions, e.g. forming the circuit by mechanical or chemical treatment of a conductive foil, paste, or film on an insulating support.
This sub-class is understood as covering combinations of a radio or television receiver with apparatus having a different main function.
This sub-class is also understood as covering printed circuits structurally associated with non-printed electric components.
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 3/04
· ·
the conductive material being removed mechanically, e.g. by punching
H05K 3/06
· ·
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/07
· · ·
being removed electrolytically [3]
H05K 3/08
· ·
the conductive material being removed by electric discharge, e.g. by spark erosion
H05K 3/10
·
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/12
· ·
using printing techniques to apply the conductive material
H05K 3/14
· ·
using spraying techniques to apply the conductive material
H05K 3/16
· · ·
by cathodic sputtering
H05K 3/18
· ·
using precipitation techniques to apply the conductive material
H05K 3/20
· ·
by affixing prefabricated conductor pattern
H05K 3/22
·
Secondary treatment of printed circuits
H05K 3/24
· ·
Reinforcing of the conductive pattern
H05K 3/26
· ·
Cleaning or polishing of the conductive pattern
H05K 3/28
· ·
Applying non-metallic protective coatings
H05K 3/30
·
Assembling printed circuits with electric components, e.g. with resistor
H05K 3/32
· ·
electrically connecting electric components or wires to printed circuits
H05K 3/34
· · ·
by soldering
H05K 3/36
·
Assembling printed circuits with other printed circuits
H05K 3/38
·
Improvement of the adhesion between the insulating substrate and the metal [3]
H05K 3/40
·
Forming printed elements for providing electric connections to or between printed circuits [3]