|  | H |
SECTION H — ELECTRICITY

|  | H05 |
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

|  | H05K |
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (casings for, or constructional details of, types of apparatus, see the relevant sub-classes; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant class)

|  | H05K |
Note(s) "Printed circuits" are understood as covering all kinds of mechanical constructions of circuits that consist of an insulating base or support carrying the conductor and are combined structurally with the conductor throughout their length, especially in a two-dimensional plane, the conductors of which are secured to the base in a non-dismountable manner, and also as covering the processes or apparatus for manufacturing such constructions, e.g. forming the circuit by mechanical or chemical treatment of a conductive foil, paste, or film on an insulating support. This sub-class is understood as covering combinations of a radio or television receiver with apparatus having a different main function.

|  | H05K 1/00 |
Printed circuits

|  | H05K 1/02 |
· | Details

|  | H05K 1/04 |
· · | Means for providing electric connection to or between printed circuits

|  | H05K 1/06 |
· · · | by edge connectors

|  | H05K 1/07 |
· · · · | disconnectible

|  | H05K 1/08 |
· · · | by surface connectors

|  | H05K 1/10 |
· · · · | non-disconnectible

|  | H05K 1/12 |
· · · · | disconnectible

|  | H05K 1/14 |
· · | Structural association of two or more printed circuits (providing electric connection to or between printed circuits Fulltext... Hierarchy... Expanded...H05K 1/04)

|  | H05K 1/16 |
· | incorporating printed electric components, e.g. printed resistor, capacitor, inductor

|  | H05K 1/18 |
· | Structurally associated with non-printed electric components (Fulltext... Hierarchy... Expanded...H05K 1/16 takes precedence)

|  | H05K 3/00 |
Apparatus or processes for manufacturing printed circuits (printing printed circuits Fulltext... Hierarchy... Expanded...B41M 3/08; involving the manufacture of a semiconductor device Fulltext... Hierarchy... Expanded...H01L)

|  | H05K 3/02 |
· | in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

|  | H05K 3/04 |
· · | the conductive material being removed mechanically, e.g. by punching

|  | H05K 3/06 |
· · | the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

|  | H05K 3/08 |
· · | the conductive material being removed by electric discharge, e.g. by spark erosion

|  | H05K 3/10 |
· | in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

|  | H05K 3/12 |
· · | using printing techniques to apply the conductive material

|  | H05K 3/14 |
· · | using spraying techniques to apply the conductive material

|  | H05K 3/16 |
· · · | by cathodic sputtering

|  | H05K 3/18 |
· · | using precipitation techniques to apply the conductive material

|  | H05K 3/20 |
· · | by affixing prefabricated conductor pattern

|  | H05K 3/22 |
· | Secondary treatment of printed circuits

|  | H05K 3/24 |
· · | Reinforcing of the conductive pattern

|  | H05K 3/26 |
· · | Cleaning or polishing of the conductive pattern

|  | H05K 3/28 |
· · | Applying non-metallic protective coatings

|  | H05K 3/30 |
· | Assembling printed circuits with electric components, e.g. with resistor

|  | H05K 3/32 |
· · | electrically connecting electric components or wires to printed circuits

|  | H05K 3/34 |
· · · | by soldering

|  | H05K 3/36 |
· | Assembling printed circuits with other printed circuits

|  | H05K 5/00 |
Casings, cabinets or drawers for electric apparatus (in general Fulltext... Hierarchy... Expanded...A47B)

|  | H05K 5/02 |
· | Details

|  | H05K 5/03 |
· · | Covers

|  | H05K 5/04 |
· | Metal casings

|  | H05K 5/06 |
· | Hermetically-sealed casings

|  | H05K 7/00 |
Constructional details common to different types of electric apparatus (casings, cabinets, drawers Fulltext... Hierarchy... Expanded...H05K 5/00)

|  | H05K 7/02 |
· | Arrangements of circuit components or wiring on supporting structure

|  | H05K 7/04 |
· · | on conductive chassis

|  | H05K 7/06 |
· · | on insulating boards

|  | H05K 7/08 |
· · · | on perforated boards

|  | H05K 7/10 |
· · | Plug-in assemblages of components

|  | H05K 7/12 |
· · | Resilient or clamping means for holding component to structure (holding two-part couplings together Fulltext... Hierarchy... Expanded...H01R 13/00)

|  | H05K 7/14 |
· | Mounting supporting structure in casing or on frame or rack

|  | H05K 7/16 |
· · | on hinges or pivots

|  | H05K 7/18 |
· | Construction of rack or frame

|  | H05K 7/20 |
· | Modifications to facilitate cooling, ventilating, or heating

|  | H05K 9/00 |
Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an aerial Fulltext... Hierarchy... Expanded...H01Q 17/00)

|  | H05K 10/00 |
Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar stand-by unit

|  | H05K 11/00 |
Combinations of a radio or television receiver with apparatus having a different main function

|  | H05K 11/02 |
· | with vehicles

|  | H05K 13/00 |
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

|  | H05K 13/02 |
· | Feeding of components (in general Fulltext... Hierarchy... Expanded...B65G)

|  | H05K 13/04 |
· | Mounting of components

|  | H05K 13/06 |
· | Wiring by machine

|  | H05K 13/08 |
· | Monitoring manufacture of assemblages