IPC 7 English version H01L 23/00-H01L 25/18

IPC ⁷ English version

H01L - H01L 21/98

H01L02300-H01L02518

H01L 27/00 - H01L 29/96

SECTION H – ELECTRICITY

H 01

BASIC ELECTRIC ELEMENTS

H 01 L

SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR (conveying systems for semiconductor wafers B65G 49/07; use of semiconductor devices for measuring G01; details of scanning-probe apparatus, in general G12B 21/00; resistors in general H01C; magnets, inductors, transformers H01F; capacitors in general H01G; electrolytic devices H01G 9/00; batteries, accumulators H01M; waveguides, resonators, or lines of the waveguide type H01P; line connectors, current collectors H01R; stimulated-emission devices H01S; electromechanical resonators H03H; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R; electric light sources in general H05B; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components H05K; use of semiconductor devices in circuits having a particular application, see the subclass for the application) [2]

23/

Details of semiconductor or other solid state devices (H01L 25/00 takes precedence) [2,5]

Note

This group does not cover:

–

details of semiconductor bodies or of electrodes of devices provided for in group H01L 29/00, which details are covered by that group;

–

details peculiar to devices provided for in a single main group of groups H01L 31/00 to H01L 49/00, which details are covered by those groups. [5]

23/

Containers; Seals (H01L 23/12, H01L 23/34, H01L 23/48, H01L 23/552 take precedence) [2,5]

23/

characterised by the shape [2]

23/

043

the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body [5]

23/

045

the other leads having an insulating passage through the base [5]

23/

047

the other leads being parallel to the base [5]

23/

049

the other leads being perpendicular to the base [5]

23/

051

another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type [5]

23/

053

the container being a hollow construction and having an insulating base as a mounting for the semiconductor body [5]

23/

055

the leads having a passage through the base [5]

23/

057

the leads being parallel to the base [5]

23/

characterised by the material of the container or its electrical properties [2]

23/

the material being an electrical insulator, e.g. glass [2]

23/

characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container [2]

23/

Mountings, e.g. non-detachable insulating substrates [2]

23/

characterised by the shape [5]

23/

characterised by the material or its electrical properties [2]

23/

Ceramic or glass substrates [5]

23/

Fillings or auxiliary members in containers, e.g. centering rings (H01L 23/42, H01L 23/552 take precedence) [2,5]

23/

Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device [2]

Note

Group H01L 23/26 takes precedence over groups H01L 23/20 to H01L 23/24. [2]

23/

gaseous at the normal operating temperature of the device [2]

23/

liquid at the normal operating temperature of the device [2]

23/

solid or gel, at the normal operating temperature of the device [2]

23/

including materials for absorbing or reacting with moisture or other undesired substances [2]

23/

Encapsulation, e.g. encapsulating layers, coatings (H01L 23/552 takes precedence) [2,5]

23/

characterised by the material [5]

23/

characterised by the arrangement [5]

23/

Holders for supporting the complete device in operation, i.e. detachable fixtures (H01L 23/40 takes precedence; connectors in general H01R; for printed circuits H05K) [2,5]

23/

Arrangements for cooling, heating, ventilating or temperature compensation [2,5]

23/

Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks [2]

23/

367

Cooling facilitated by shape of device [5]

23/

373

Cooling facilitated by selection of materials for the device [5]

23/

Cooling arrangements using the Peltier effect [2]

23/

Mountings or securing means for detachable cooling or heating arrangements [2]

23/

Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling (characterised by selection of materials for the device H01L 23/373) [2,5]

23/

427

Cooling by change of state, e.g. use of heat pipes [5]

23/

433

Auxiliary members characterised by their shape, e.g. pistons [5]

23/

the complete device being wholly immersed in a fluid other than air (H01L 23/427 takes precedence) [2,5]

23/

involving the transfer of heat by flowing fluids (H01L 23/42, H01L 23/44 take precedence) [2]

23/

467

by flowing gases, e.g. air [5]

23/

473

by flowing liquids [5]

23/

Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements (in general H01R) [2]

23/

482

consisting of lead-in layers inseparably applied to the semiconductor body [5]

23/

485

consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts [5]

23/

488

consisting of soldered constructions [5]

23/

wire-like [5]

23/

492

Bases or plates [5]

23/

495

Lead-frames [5]

23/

498

Leads on insulating substrates [5]

23/

for integrated circuit devices (H01L 23/482 to H01L 23/498 take precedence) [2,5]

23/

Arrangements for conducting electric current within the device in operation from one component to another [2]

23/

522

including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body [5]

23/

525

with adaptable interconnections [5]

23/

528

Layout of the interconnection structure [5]

23/

532

characterised by the materials [5]

23/

535

including internal interconnections, e.g. cross-under constructions [5]

23/

538

the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates (mountings H01L 23/12) [5]

23/

544

Marks applied to semiconductor devices, e.g. registration marks, test patterns [5]

23/

552

Protection against radiation, e.g. light [5]

23/

556

against alpha rays [5]

23/

Structural electrical arrangements for semiconductor devices not otherwise provided for [5]

23/

Protection against electrostatic charges or discharges, e.g. Faraday shields (in general H05F) [5]

23/

Protection against overcurrent or overload, e.g. fuses, shunts [5]

23/

Impedance arrangements [5]

23/

High-frequency adaptations [5]

25/

Assemblies consisting of a plurality of individual semiconductor or other solid state devices (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00; assemblies of photoelectronic cells H01L 31/042; generators using solar cells or solar panels H02N 6/00; details of complete circuit assemblies provided for in another subclass, e.g. details of television receivers, see the relevant subclass, e.g. H04N; details of assemblies of electrical components in general H05K) [2,5]

25/

all the devices being of a type provided for in the same subgroup of groups H01L 27/00 to H01L 49/00, e.g. assemblies of rectifier diodes [5]

25/

the devices not having separate containers [2]

25/

065

the devices being of a type provided for in group H01L 27/00 [5]

25/

the devices being of a type provided for in group H01L 29/00 [5]

25/

075

the devices being of a type provided for in group H01L 33/00 [5]

25/

the devices having separate containers [2]

25/

the devices being of a type provided for in group H01L 29/00 [5]

25/

the devices being of a type provided for in group H01L 33/00 [5]

25/

the devices being of types provided for in two or more different main groups of groups H01L 27/00 to H01L 49/00, e.g. forming hybrid circuits [2]

25/

the devices being of types provided for in two or more different subgroups of the same main group of groups H01L 27/00 to H01L 49/00 [5]

H01L - H01L 21/98

H01L 27/00 - H01L 29/96