IPC 7 English version
  G11C - G11C 11/56  
G11C01300-G11C02900
 

SECTION G – PHYSICS


G 11INFORMATION STORAGE


G 11 CSTATIC STORES (information storage based on relative movement between record carrier and transducer G11B; semiconductor devices for storage H01L, e.g. H01L 27/108 to H01L 27/115; pulse technique in general H03K, e.g. electronic switches H03K 17/00)


13/

00Digital stores characterised by the use of storage elements not covered by groups G11C 11/00, G11C 23/00, or G11C 25/00

13/

02.using elements whose operation depends upon chemical change (using electrochemical charge G11C 11/00)

13/

04.using optical elements

13/

06..using magneto-optical elements (magneto-optics in general G02F)  [2]


14/

00Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down  [5]


15/

00Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores (in which information is addressed to a specific location G11C 11/00) [2]

15/

02.using magnetic elements  [2]

15/

04.using semiconductor elements  [2]

15/

06.using cryogenic elements  [2]


16/

00Erasable programmable read-only memories (G11C 14/00 takes precedence) [5]

16/

02.electrically programmable  [5]

16/

04..using variable threshold transistors, e.g. FAMOS  [5]

16/

06..Auxiliary circuits, e.g. for writing into memory (in general G11C 7/00)  [5]

16/

08...Address circuits; Decoders; Word-line control circuits [7]

 

16/

10...Programming or data input circuits [7]

 

16/

12....Programming voltage switching circuits [7]

 

16/

14....Circuits for erasing electrically, e.g. erase voltage switching circuits [7]

 

16/

16.....for erasing blocks, e.g. arrays, words, groups [7]

 

16/

18....Circuits for erasing optically [7]

 

16/

20....Initialising; Data preset; Chip identification [7]

 

16/

22...Safety or protection circuits preventing unauthorised or accidental access to memory cells [7]

 

16/

24...Bit-line control circuits [7]

 

16/

26...Sensing or reading circuits; Data output circuits [7]

 

16/

28....using differential sensing or reference cells, e.g. dummy cells [7]

 

16/

30...Power supply circuits [7]

 

16/

32...Timing circuits [7]

 

16/

34...Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention [7]

 


17/

00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards (erasable programmable read-only memories G11C 16/00; coding, decoding or code conversion, in general H03M) [2,5]

17/

02.using magnetic or inductive elements (G11C 17/14 takes precedence)  [2,5]

17/

04.using capacitive elements (G11C 17/06, G11C 17/14 take precedence)  [2,5]

17/

06.using diode elements (G11C 17/14 takes precedence)  [2,5]

17/

08.using semiconductor devices, e.g. bipolar elements (G11C 17/06, G11C 17/14 take precedence)  [5]

17/

10..in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM  [5]

17/

12...using field-effect devices  [5]

17/

14.in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM  [5]

17/

16..using electrically-fusible links  [5]

17/

18..Auxiliary circuits, e.g. for writing into memory (in general G11C 7/00)  [5]


19/

00Digital stores in which the information is moved stepwise, e.g. shift registers (counting chains H03K 23/00)

19/

02.using magnetic elements (G11C 19/14 takes precedence)  [2]

19/

04..using cores with one aperture or magnetic loop  [2]

19/

06..using structures with a number of apertures or magnetic loops, e.g. transfluxors  [2]

19/

08..using thin films in plane structure  [2]

19/

10..using thin films on rods; with twistors  [2]

19/

12.using non-linear reactive devices in resonant circuits  [2]

19/

14.using magnetic elements in combination with active elements, e.g. discharge tubes, semiconductor elements (G11C 19/34 takes precedence) [2,7]

19/

18.using capacitors as main elements of the stages  [2]

19/

20.using discharge tubes (G11C 19/14 takes precedence)  [2]

19/

28.using semiconductor elements (G11C 19/14, G11C 19/36 take precedence) [2,7]

19/

30.using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled  [2]

19/

32.using super-conductive elements  [2]

19/

34.using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency [7]

 

19/

36..using semiconductor elements [7]

 

19/

38.two-dimensional, e.g. horizontal and vertical shift registers [7]

 


21/

00Digital stores in which the information circulates (stepwise G11C 19/00)

21/

02.using electromechanical delay lines, e.g. using a mercury tank


23/

00Digital stores characterised by movement of mechanical parts to effect storage, e.g. using balls; Storage elements therefor (storing by actuating contacts G11C 11/48)


25/

00Digital stores characterised by the use of flowing media; Storage elements therefor


27/

00Electric analogue stores, e.g. for storing instantaneous values

27/

02.Sample-and-hold arrangements (G11C 27/04 takes precedence; sampling electrical signals, in general H03K)  [2,4]

27/

04.Shift registers (charge coupled devices per se H01L 29/76)  [4]


29/

00Checking stores for correct operation

  G11C - G11C 11/56